Semiconductor framework epoxy resin packaging products overflow (Deflashing) removing special equipment

Suitable for: plastic discrete and integrated circuits (triode and IC)

Purpose: epoxy encapsulation overflow removed

Can provide electrolysis, cleaning, electroplating process of a complete set of. Can provide materials for processing. Can provide sample electrolysis, cleaning, electroplating!

The machine features

Excellent performance and price and let you "spend a penny, buy two goods";

The stainless steel structure, acid and base, beautiful and easy;

Unibody design, compact, easy to operate;

Mobile operation, avoid product scratch;

Configuration filtration system, effective save water;

Perfect after-sale service system and implement "turnkey", real let you "buy the rest assured, use at ease";

The stainless steel mesh belt transmission, thorough cleaning effect, high washing efficiency;

Configuration water-oil separation and filtration system, provide the utilization rate of cleaning agents;

The operation is simple, with manual and automatic conversion function;

PLC program control all, automatic and continuous stepping type clean, dry;